JPH0735407Y2 - Pc基板装置 - Google Patents
Pc基板装置Info
- Publication number
- JPH0735407Y2 JPH0735407Y2 JP1990018219U JP1821990U JPH0735407Y2 JP H0735407 Y2 JPH0735407 Y2 JP H0735407Y2 JP 1990018219 U JP1990018219 U JP 1990018219U JP 1821990 U JP1821990 U JP 1821990U JP H0735407 Y2 JPH0735407 Y2 JP H0735407Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- lead plate
- connection terminals
- large current
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000002788 crimping Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990018219U JPH0735407Y2 (ja) | 1990-02-27 | 1990-02-27 | Pc基板装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990018219U JPH0735407Y2 (ja) | 1990-02-27 | 1990-02-27 | Pc基板装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH03110868U JPH03110868U (en]) | 1991-11-13 |
JPH0735407Y2 true JPH0735407Y2 (ja) | 1995-08-09 |
Family
ID=31521381
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990018219U Expired - Fee Related JPH0735407Y2 (ja) | 1990-02-27 | 1990-02-27 | Pc基板装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0735407Y2 (en]) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4670645B2 (ja) * | 2006-01-11 | 2011-04-13 | パナソニック株式会社 | 身体しずく除去乾燥装置 |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6013765U (ja) * | 1983-07-05 | 1985-01-30 | 松下電器産業株式会社 | プリント基板 |
-
1990
- 1990-02-27 JP JP1990018219U patent/JPH0735407Y2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH03110868U (en]) | 1991-11-13 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5446626A (en) | Pluggable assembly, particularly a relay module for motor vehicles | |
JP4584600B2 (ja) | 回路構成体 | |
JP4002074B2 (ja) | 車載用電装ユニット | |
US7121893B2 (en) | Electrical switch having an electrical connection element | |
CN104021932A (zh) | 电子部件和电子控制单元 | |
US6281449B1 (en) | Printed board, manufacturing method therefor and structure for connecting conductor elements to the printed board | |
JP2002359349A (ja) | 車載用電装ユニット、半導体リレーモジュール及びそれに用いられるリードフレーム | |
JPH0735407Y2 (ja) | Pc基板装置 | |
JP2523389Y2 (ja) | Pc基板装置 | |
JP2007281138A (ja) | 配線基板 | |
JP5516076B2 (ja) | 回路構成体及び電気接続箱 | |
JP2013038948A (ja) | 回路構成体及び電気接続箱 | |
JP3685046B2 (ja) | ジャンクションボックス | |
KR200227957Y1 (ko) | 연결단자를 갖는 인쇄회로기판 적층 정션박스 | |
JPH0371688A (ja) | 少なくとも2つの異なる電子部品群を備えたプリント配線板 | |
JP2002374607A (ja) | 電気接続箱におけるバスバーの配線構造 | |
US5506447A (en) | Hybrid integrated circuit | |
JP4442040B2 (ja) | 電気回路装置 | |
JPH08307032A (ja) | 回路基板装置 | |
JPS5818200Y2 (ja) | ソケツト | |
JP2005516426A (ja) | 制御装置 | |
JPS6327410Y2 (en]) | ||
JP3515833B2 (ja) | 配線基板 | |
KR0125799Y1 (ko) | 릴레이 접점단자의 방열구조 | |
JP6739445B2 (ja) | アセンブリ |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
LAPS | Cancellation because of no payment of annual fees |